What is hBN?
Hexagonal Boron Nitride (hBN)
Aurexene Materials hBN is a family of thermally conductive, electrically insulating platelet powders for thermal fillers and TIMs, epoxy molding compounds, underfills, encapsulants, and HBM package heat paths.
Technical owner: Aurexene Materials Engineering Team · Last updated: 2026-08-30
Bukan apa
- hBN is hexagonal boron nitride, not cubic boron nitride and not an electrically conductive carbon analogue of graphite.
- A standard hBN powder grade is not a ready-to-use liquid coolant; liquid-loop hBN nanofluids are separately formulated and qualified dispersions.
When Not to Use It
- Do not use hBN when the material must form an electrically conductive pathway or when high ceramic loading and platelet orientation cannot be accommodated.
Intrinsic Screening Summary
- Identity screen
- BN; Platelet
Kesesuaian aplikasi
Selection & Validation Framework
| Decision Question | Jawaban pada tingkat material |
|---|---|
| Integration and processing criteria | Required for: Pembuangan Panas. Measure: particle distribution; settling; redispersion; storage stability; moisture exposure. Sample state: final host formulation or part state. Failure signals: Thermal path remains discontinuous or interface resistance dominates measured heat flow.. |
Material Identity & Specification Status
Nilai kemasan yang disetujui belum dipublikasikan; konfirmasikan saat penawaran atau peninjauan sampel.
| Sifat | Nilai |
|---|---|
| Composition | BN |
| CAS / identity | 10043-11-5 |
| Particle size | D50 khusus mutu dari <1,0 hingga 30,4 µm untuk mutu serbuk |
| Morfologi | Platelet |
| densitas | Grade-specific; powder loose density is 0.36 to 0.82 g/cm3 |
| Kemurnian | Mutu serbuk standar mengandung 99,0–99,2% BN; mutu dengan kemurnian 99,9% dan 99,99% dapat disesuaikan berdasarkan permintaan |
| Penyimpanan | Simpan tertutup di area yang kering dan bersih, jauh dari kelembapan dan kontaminasi |
Compare Material Routes
Material Evidence
Technical Guides
| Technical Guide | Summary |
|---|---|
| Bond-Line Thickness, Contact Pressure, and Surface Roughness in Thermal Interfaces | An assembly-level method for separating bulk-layer resistance from two contact interfaces while controlling bond-line thickness, pressure, surface topography, coverage, aging, and mechanical retention. |
| Controlling Voids and Porosity in Thermal Adhesives, Encapsulants, Pads, and Composites | A defect-control method that distinguishes air, moisture, volatiles, wetting, cure, delivery, and assembly causes, then verifies void location and finished thermal-interface response. |
| Hybrid hBN, AlN, and Insulating-Filler Networks for Higher Thermal Transport | Hybrid Hexagonal Boron Nitride (hBN), AlN, and Insulating-Filler Networks for Higher Thermal Transport — panduan rekayasa berbasis metode untuk Thermally Conductive & Electrically Insulating Polymers yang membahas perilaku struktur–fungsi pada batas material, antarmuka, dan sistem akhir, beserta batas proses, validasi, dan kualifikasi. |
FAQ
Why does hBN work for thermal conductivity and heat dissipation?
Hexagonal BN provides a platelet heat-conduction route through a host while remaining electrically insulating; interface resistance, orientation, loading, and dispersion determine the result.
Is hBN used for electrical insulation or thermal conductivity?
Both properties are the reason it is selected: hBN can move heat without creating the electrically conductive carbon network associated with carbon fillers.
What must be validated before using hBN for thermal conductivity?
Validate particle distribution, wetting, platelet orientation, thermal interface resistance, loading, viscosity, polymer compatibility, and thermal cycling in the final host.
How does hBN fit epoxy molding compounds and semiconductor packaging?
hBN can serve as an electrically insulating ceramic filler in thermally conductive epoxy molding compounds, underfills, encapsulants, prepregs, and TIM layers. The finished package still requires thermal, dielectric, moisture, cure, adhesion, CTE, and warpage qualification.
Can hBN be used in HBM liquid-cooling systems?
Distinguish the role. hBN is relevant in solid package heat paths that move heat from HBM toward a liquid-cooled cold plate. Experimental hBN-water nanofluids have also been studied in computer cooling loops, but they are separate formulations requiring fluid stability, pumping, clogging or erosion, dielectric, and materials-compatibility qualification.
Commercial Availability
Supplier role: Request confirmation
Supply status: Request confirmation
Sample status: Sample availability requires confirmation
Commercial details are not published until the source and verification fields are complete and the Supplier Data Packet is signed by the sales owner, technical reviewer, and resource/compliance owner. Request current grade, form, sample, packaging, and delivery confirmation.
Dokumen dan permintaan
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Lembar data teknis
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Lembar data keselamatan
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Grade, Sample & Qualification Support
The Aurexene Materials Engineering Team can review the required form, host system, formulation or process, target, sample quantity, volume and timeline, and the grade-specific evidence needed before qualification.
Review Kemampuan laboratorium for sample evaluation and qualification support, or Kemampuan produksi for scale-up, quality, documentation, and supply support.
Request hBN Sample / Qualification Review