What is Nano Ni Powder?
Nano Ni Powder
Serbuk Nano Ni adalah serbuk nikel berskala nano dengan identitas kimia Ni. Sifat kemagnetannya membedakan jalur evaluasinya dari serbuk nano perak, tembaga, dan timah.
Technical owner: Aurexene Materials Engineering Team
Bukan apa
- Nano Ni Powder is standalone nanoscale nickel, not an SWCNT-nano-Ni hybrid.
When Not to Use It
- Do not use Nano Ni Powder when magnetic response, nickel restrictions, oxidation, or nickel-free requirements are incompatible with the application.
Intrinsic Screening Summary
- Identity screen
- Ni; Nanoscale nickel particles
Kesesuaian aplikasi
| Application | Suitability | Kondisi | Limitations |
|---|---|---|---|
| MLCC Internal-Electrode, Termination & Dielectric Materials | GOOD FIT | Rute yang tercantum dalam brosur: pasta nikel untuk elektroda internal MLCC dan pengembangan elektroda internal untuk MLCC atau keramik elektronik. | Konfirmasikan grade yang tepat, lapisan oksida, formulasi, kondisi pembakaran, kontinuitas elektroda, dan keandalan. |
| Conductive Plastics & Coatings | GOOD FIT | Rute yang tercantum dalam brosur: pelapis konduktif nikel dan pengisi komposit. | Konfirmasikan grade yang tepat, lapisan oksida, formulasi, kondisi proses, kinerja, dan keandalan. |
| Material Pelindung EMI | GOOD FIT | Rute yang tercantum dalam brosur: pelapis perisai dan lapisan perisai. | Konfirmasikan perisai pada frekuensi target, pembumian, pengendalian oksida, dan ketahanan lingkungan. |
| Electronic Packaging & Interconnects | CONDITIONAL | Rute baru dalam brosur: elektroda nikel yang dapat dicetak dan interkoneksi mikroelektronik. | Ini adalah rute litbang; validasi proyek diperlukan. |
Material Identity & Specification Status
Nilai kemasan yang disetujui belum dipublikasikan; konfirmasikan saat penawaran atau peninjauan sampel.
| Sifat | Nilai |
|---|---|
| Composition | Ni |
| CAS / identity | 7440-02-0 |
| Particle size | HF-NPNI-40: 40-60 nm; HF-NPNI-100: 100-140 nm (final by COA/PSD) |
| Morfologi | Nanoscale nickel particles |
| densitas | 8.90 g/cm3 intrinsic nickel density |
| Kemurnian | Batch purity confirmed by COA/ICP report |
| Penyimpanan | Dry sealed container |
Technical Guides
| Technical Guide | Summary |
|---|---|
| Adhesion, Die Shear, Peel, Cross-Section, and Fractography for Interconnect Qualification | Match the mechanical method to the package load path and use cross-sections and complete failure-surface allocation to determine whether a result represents joint cohesion, one interface, metallization, substrate, fixture, or mixed failure. |
| Atmosphere and Oxygen Control for Copper and Nickel Conductive Materials | Define the atmosphere at the material and joint through temperature, oxygen potential, moisture, gas composition, flow, pressure, leaks, organics, loading, cooling, and exposure—not from the nominal gas label or inlet reading. |
| Binder Burnout, Drying, and Organic Residue Control Before Sintering | Coordinate solvent removal, binder migration and decomposition, gas escape, atmosphere, and the onset of metal contact formation so drying or debinding does not create residue, voids, cracks, delamination, oxidation, or blocked interfaces. |
| CCTO Permittivity, Dielectric Loss, Leakage, and Internal-Barrier-Layer Behavior | Calcium Copper Titanate (CCTO) Permittivity, Dielectric Loss, Leakage, and Internal-Barrier-Layer Behavior — a method-conditioned engineering guide for MLCC Internal-Electrode, Termination & Dielectric Materials covering particle packing, surface oxide chemistry, shrinkage matching, grain-boundary behavior, and electrode-dielectric interface continuity, process limits, validation, and qualification boundaries. |
| Characterizing Nickel Powder, CCTO Powder, Pastes, Printed Layers, and Fired Microstructures | Characterizing Nickel Powder, Calcium Copper Titanate (CCTO) Powder, Pastes, Printed Layers, and Fired Microstructures — a method-conditioned engineering guide for MLCC Internal-Electrode, Termination & Dielectric Materials covering particle packing, surface oxide chemistry, shrinkage matching, grain-boundary behavior, and electrode-dielectric interface continuity, process limits, validation, and qualification boundaries. |
Commercial Availability
Supplier role: Request confirmation
Supply status: Request confirmation
Sample status: Sample availability requires confirmation
Commercial details are not published until the source and verification fields are complete and the Supplier Data Packet is signed by the sales owner, technical reviewer, and resource/compliance owner. Request current grade, form, sample, packaging, and delivery confirmation.
Dokumen dan permintaan
Document access follows the current approval state. Unapproved or unavailable files route to a document request instead of a public download.
Lembar data teknis
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Lembar data keselamatan
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Related resources
Grade, Sample & Qualification Support
The Aurexene Materials Engineering Team can review the required form, host system, formulation or process, target, sample quantity, volume and timeline, and the grade-specific evidence needed before qualification.
Review Kemampuan laboratorium for sample evaluation and qualification support, or Kemampuan produksi for scale-up, quality, documentation, and supply support.
Request Nano Ni Powder Sample / Qualification Review