What is Nano Ag Powder?
Nano Ag Powder
Serbuk Nano Ag adalah serbuk perak berskala nano dengan identitas kimia Ag. Kimia perak dan morfologi partikel konduktif membedakan jalur material ini dari serbuk nano tembaga, nikel, dan timah.
Technical owner: Aurexene Materials Engineering Team · Last updated: 2026-08-30
Bukan apa
- Nano Ag Powder is standalone nanoscale silver, not an SWCNT-nano-Ag hybrid.
When Not to Use It
- Do not use Nano Ag Powder when silver migration, cost, ion release, or silver-free requirements cannot be managed.
Intrinsic Screening Summary
- Identity screen
- Ag; partikel perak skala nano
- Intrinsic feature
- Keep silver identity and surface chemistry distinct from copper. Contact formation does not remove the need to qualify migration, corrosion, storage, and particle-population stability.
- Material-level integration
- Track surface state, particle distribution, agglomeration, vehicle compatibility, storage change, and contact development for the exact grade. Do not transfer copper atmosphere, oxide-removal, or storage controls to Nano Ag Powder without matched evidence.
Kesesuaian aplikasi
| Application | Suitability | Kondisi | Limitations |
|---|---|---|---|
| Printed Electronics Inks & Conductive Pastes | SESUAI | Rute yang tercantum dalam brosur: jalur cetak, RFID, sakelar membran, lapisan konduktif pada substrat fleksibel, pasta berkadar padatan tinggi, dan elektroda film tebal. | Konfirmasikan grade yang tepat, formulasi, kondisi proses, kinerja, dan keandalan. |
| Kemasan elektronik dan interkoneksi | BERSYARAT | Rute baru dalam brosur: sintering perak, lapisan perak berpori rendah, dan penyambungan modul area luas. | Ini adalah rute litbang; validasi proyek diperlukan. |
Selection & Validation Framework
| Decision Question | Jawaban pada tingkat material |
|---|---|
| Grade, formulation, contact, and reliability screen | Required for: Printed Electronics Inks & Conductive Pastes and Electronic Packaging & Interconnects. Measure: grade identity and lot COA; particle-size distribution and agglomeration state; formulation rheology and storage change; cured or sintered resistance and contact resistance; adhesion and substrate compatibility; migration, corrosion, and environmental aging. Sample state: Exact grade in the intended vehicle, substrate, geometry, and process window. Failure signals: Resistance, adhesion, migration, corrosion, or aging falls outside the customer acceptance method.. |
Identitas material dan status spesifikasi
Nilai kemasan yang disetujui belum dipublikasikan; konfirmasikan saat penawaran atau peninjauan sampel.
| Sifat | Nilai |
|---|---|
| Komposisi | Ag |
| CAS / identitas | 7440-22-4 |
| Ukuran partikel | HF-NPAG-20: 20-40 nm; HF-NPAG-100: 100-140 nm (final by COA/PSD) |
| Morfologi | Partikel perak skala nano |
| densitas | 10.49 g/cm3 densitas teoretis |
| Kemurnian | Kemurnian batch dikonfirmasi melalui COA dan laporan ICP |
| Penyimpanan | Wadah kering tertutup |
Why It Works
| Struktur | Fungsi | Mekanisme |
|---|---|---|
| Elemental Ag nanoparticles; exact particle-size distribution, surface state, agglomeration, and grade purity remain specification fields. | Silver-particle route whose material screen centers on surface condition, particle contacts, migration, and silver-specific supply and cost constraints. | Keep silver identity and surface chemistry distinct from copper. Contact formation does not remove the need to qualify migration, corrosion, storage, and particle-population stability. |
Compare Material Routes
Why choose Nano Ag over Nano Cu?
Choose Nano Ag when the design prioritizes high conductivity, lower oxidation sensitivity, and a more forgiving sintering window. Nano Cu may reduce raw-material cost, but it requires tighter oxide control, atmosphere management, storage, and corrosion qualification.
Explore related silver routes: Nano Silver Paste and SWCNT-nano-Ag .
| Material / Route | Decision Boundary |
|---|---|
| Nano Silver Paste | Nano Ag Powder is the standalone silver-powder route, while Nano Silver Paste is a formulated silver-paste material route. Compare powder identity with the formulated paste state without transferring paste-level processing or performance claims to the powder. |
| SWCNT-nano-Ag | Nano Ag Powder is standalone silver powder, while SWCNT-nano-Ag is a carbon-nanotube–silver hybrid material route. Compare standalone silver identity with the hybrid architecture without assuming equivalent structure, processing, or delivered behavior. |
| Nano Cu Powder | Nano Ag Powder is the elemental silver route with a different surface, migration, supply, and delivered-cost boundary. Nano Cu Powder adds copper-specific oxidation, atmosphere, and corrosion controls; compare exact powder state and contact evidence rather than assuming all metal nanopowders process alike. |
Technical Guides
| Technical Guide | Summary |
|---|---|
| How Particle Size, Shape, Packing, and Surface Chemistry Control Bondline Densification | How Particle Size, Shape, Packing, and Surface Chemistry Control Bondline Densification — panduan rekayasa berbasis metode untuk Silver & Copper Sintering Die-Attach Materials yang membahas perilaku struktur–fungsi pada batas material, antarmuka, dan sistem akhir, beserta batas proses, validasi, dan kualifikasi. |
| How Surface Oxides Control Silver, Copper, Nickel, and Tin Sintering | Separate silver, copper, nickel, and tin surface chemistry before selecting storage, paste chemistry, atmosphere, debinding, thermal profile, and interface controls for conductive joints. |
| Oxidation, Corrosion, and Galvanic Failure in Conductive Joints | Distinguish dry or gas-phase oxidation, electrolyte-mediated corrosion, galvanic coupling, and other interface aging by registering environment, contamination, metal and metallization chemistry, geometry, bias, products, material loss, resistance, and failure location. |
| Qualifying Silver and Copper Sinter Materials with Powder, Paste, Process-Window, Package, and Change-Control Data | Qualifying Silver and Copper Sinter Materials with Powder, Paste, Process-Window, Package, and Change-Control Data — panduan rekayasa berbasis metode untuk Silver & Copper Sintering Die-Attach Materials yang membahas perilaku struktur–fungsi pada batas material, antarmuka, dan sistem akhir, beserta batas proses, validasi, dan kualifikasi. |
Commercial Availability
Supplier role: Request confirmation
Supply status: Request confirmation
Sample status: Sample availability requires confirmation
Commercial details are not published until the source and verification fields are complete and the Supplier Data Packet is signed by the sales owner, technical reviewer, and resource/compliance owner. Request current grade, form, sample, packaging, and delivery confirmation.
Dokumen dan permintaan
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Lembar data teknis
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Lembar data keselamatan
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Related resources
Grade, Sample & Qualification Support
The Aurexene Materials Engineering Team can review the required form, host system, formulation or process, target, sample quantity, volume and timeline, and the grade-specific evidence needed before qualification.
Review Kemampuan laboratorium for sample evaluation and qualification support, or Kemampuan produksi for scale-up, quality, documentation, and supply support.
Request Nano Ag Powder Sample / Qualification Review