What is Nano Sn Powder?
Nano Sn Powder
Serbuk Nano Sn adalah serbuk timah berskala nano dengan identitas kimia Sn. Material ini merupakan serbuk nano logam mandiri, berbeda dari titanium nitrida dan material hibrida SWCNT–nano-Sn.
Technical owner: Aurexene Materials Engineering Team · Last updated: 2026-07-26
Bukan apa
- Nano Sn Powder is standalone nanoscale tin, not TiN titanium nitride or an SWCNT-nano-Sn hybrid.
When Not to Use It
- Do not use Nano Sn Powder when oxidation, melting or sintering behavior, or tin-free requirements conflict with the process.
Intrinsic Screening Summary
- Identity screen
- Sn; Nanoscale tin particles
Kesesuaian aplikasi
Material Identity & Specification Status
Nilai kemasan yang disetujui belum dipublikasikan; konfirmasikan saat penawaran atau peninjauan sampel.
| Sifat | Nilai |
|---|---|
| Composition | Sn |
| CAS / identity | 7440-31-5 |
| Particle size | HF-NPSN-40: 40-60 nm; HF-NPSN-100: 100-140 nm (final by COA/PSD) |
| Morfologi | Nanoscale tin particles |
| densitas | 7.31 g/cm3 intrinsic tin density |
| Kemurnian | Batch purity confirmed by COA/ICP report |
| Penyimpanan | Dry sealed container |
Technical Guides
| Technical Guide | Summary |
|---|---|
| Adhesion, Die Shear, Peel, Cross-Section, and Fractography for Interconnect Qualification | Match the mechanical method to the package load path and use cross-sections and complete failure-surface allocation to determine whether a result represents joint cohesion, one interface, metallization, substrate, fixture, or mixed failure. |
| Binder Burnout, Drying, and Organic Residue Control Before Sintering | Coordinate solvent removal, binder migration and decomposition, gas escape, atmosphere, and the onset of metal contact formation so drying or debinding does not create residue, voids, cracks, delamination, oxidation, or blocked interfaces. |
| CTE Mismatch, Residual Stress, Cracking, and Delamination in Interconnects | Diagnose thermomechanical failure from the constrained material stack, geometry, modulus and time dependence, process shrinkage, thermal gradients, cooling, residual state, and crack path—not from CTE difference alone. |
| Current Crowding, Joule Heating, and Resistance Growth at Conductive Interfaces | Locate the constriction or interface that concentrates current and heat, then separate bulk, contact, geometry, and aging contributions before assigning resistance growth to a conductive material. |
| Diagnosing Voids, Incomplete Sintering, and High Initial Contact Resistance | Separate void topology, metal-contact formation, both package interfaces, bulk and contact resistance, and measurement artifacts through registered process interruption and matched controls before changing material or recipe. |
Commercial Availability
Supplier role: Request confirmation
Supply status: Request confirmation
Sample status: Sample availability requires confirmation
Commercial details are not published until the source and verification fields are complete and the Supplier Data Packet is signed by the sales owner, technical reviewer, and resource/compliance owner. Request current grade, form, sample, packaging, and delivery confirmation.
Dokumen dan permintaan
Document access follows the current approval state. Unapproved or unavailable files route to a document request instead of a public download.
Lembar data teknis
Request required
Lembar data keselamatan
Request required
Related resources
Grade, Sample & Qualification Support
The Aurexene Materials Engineering Team can review the required form, host system, formulation or process, target, sample quantity, volume and timeline, and the grade-specific evidence needed before qualification.
Review Kemampuan laboratorium for sample evaluation and qualification support, or Kemampuan produksi for scale-up, quality, documentation, and supply support.
Request Nano Sn Powder Sample / Qualification Review