What is Nano Sn Powder?
Nano Sn Powder
Nano Sn Powder is nanoscale tin powder with Sn chemical identity. It is a standalone metal nanopowder, distinct from titanium nitride and the SWCNT-nano-Sn hybrid material.
Technical owner: Aurexene Materials Engineering Team · Last updated: 2026-07-26
What It Is Not
- Nano Sn Powder is standalone nanoscale tin, not TiN titanium nitride or an SWCNT-nano-Sn hybrid.
When Not to Use It
- Do not use Nano Sn Powder when oxidation, melting or sintering behavior, or tin-free requirements conflict with the process.
Intrinsic Screening Summary
- Identity screen
- Sn; Nanoscale tin particles
Application Fit
Material Identity & Specification Status
Approved values for Packaging are not published; confirm them during quotation or sample review.
Available Grades
| Grade | Form | Particle size | Purity | Typical use | Availability |
|---|---|---|---|---|---|
| HF-NPSN-40 | Powder | 40-60 nm | Batch purity confirmed by COA/ICP report | Formulation research in tin-based joining and low-melting composites | Request current grade availability |
| HF-NPSN-100 | Powder | 100-140 nm | Batch purity confirmed by COA/ICP report | Nano or submicron tin low-temperature sintering research; Sn-Bi and Sn-Ag-Cu modification research | Request current grade availability |
| Property | Value |
|---|---|
| Composition | Sn |
| CAS / identity | 7440-31-5 |
| Morphology | Nanoscale tin particles |
| Density | 7.31 g/cm3 intrinsic tin density |
| Storage | Dry sealed container |
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Technical Guides
| Technical Guide | Summary |
|---|---|
| Adhesion, Die Shear, Peel, Cross-Section, and Fractography for Interconnect Qualification | Match the mechanical method to the package load path and use cross-sections and complete failure-surface allocation to determine whether a result represents joint cohesion, one interface, metallization, substrate, fixture, or mixed failure. |
| Binder Burnout, Drying, and Organic Residue Control Before Sintering | Coordinate solvent removal, binder migration and decomposition, gas escape, atmosphere, and the onset of metal contact formation so drying or debinding does not create residue, voids, cracks, delamination, oxidation, or blocked interfaces. |
| CTE Mismatch, Residual Stress, Cracking, and Delamination in Interconnects | Diagnose thermomechanical failure from the constrained material stack, geometry, modulus and time dependence, process shrinkage, thermal gradients, cooling, residual state, and crack path—not from CTE difference alone. |
| Current Crowding, Joule Heating, and Resistance Growth at Conductive Interfaces | Locate the constriction or interface that concentrates current and heat, then separate bulk, contact, geometry, and aging contributions before assigning resistance growth to a conductive material. |
| Diagnosing Voids, Incomplete Sintering, and High Initial Contact Resistance | Separate void topology, metal-contact formation, both package interfaces, bulk and contact resistance, and measurement artifacts through registered process interruption and matched controls before changing material or recipe. |
Documents & Inquiry
Document access follows the current approval state. Unapproved or unavailable files route to a document request instead of a public download.
Technical Data Sheet
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Safety Data Sheet
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Related resources
Grade, Sample & Qualification Support
The Aurexene Materials Engineering Team can review the required form, host system, formulation or process, target, sample quantity, volume and timeline, and the grade-specific evidence needed before qualification.
Review Lab Capabilities for sample evaluation and qualification support, or Production Capabilities for scale-up, quality, documentation, and supply support.
Request Nano Sn Powder Sample / Qualification Review