What is Graphene-Cu?
Graphene Copper (Graphene-Cu)
Graphene-Cu is a graphene-copper hybrid for coupled thermal and electrical pathways. A customer-commissioned third-party test of Aurexene Materials-supplied bulk sample SC-G16 reported thermal conductivity of 610.3 W/(m·K), specific heat capacity of 0.596 J/(g·K), and thermal diffusivity of 115.9 mm²/s at 25 °C under GB/T 22588-2008.
Technical owner: Aurexene Materials Engineering Team · Last updated: 2026-07-26
What It Is Not
- Graphene-Cu is not graphene or copper powder alone; it is a graphene-copper hybrid material.
When Not to Use It
- Do not use Graphene-Cu when copper-free chemistry, electrical insulation, or unresolved corrosion and galvanic behavior rules out the hybrid.
Intrinsic Screening Summary
- Identity screen
- Graphene-copper hybrid; Hybrid carbon-metal particle morphology
- Intrinsic feature
- During consolidation, pressure can densify the material and reduce void- and interface-related resistance. It can also align graphene mainly perpendicular to the consolidation force, so conductivity can be anisotropic and higher along the graphene-plane direction. The result is not universally an increase: excessive deformation, graphene damage or agglomeration, and residual interfacial stress can add carrier-scattering sites. Confirm the pressure-conductivity response on the supplied grade and in the final test direction rather than treating it as a fixed material value.
Application Fit
Material Identity & Specification Status
Approved values for CAS / identity, Particle size, Density, Purity, and Packaging are not published; confirm them during quotation or sample review.
| Property | Value |
|---|---|
| Composition | Graphene-copper hybrid |
| Morphology | Hybrid carbon-metal particle morphology |
| Storage | Dry sealed container |
Why It Works
A customer-commissioned test report from the Center for Industrial Analysis and Testing, Guangdong Academy of Sciences records these results for one Aurexene Materials-supplied bulk sample, serial SC-G16. They are sample-level evidence, not a universal grade specification. The reported thermal conductivity calculation used the applicant-provided density of 8.825 g/cm³.
| Structure | Function | Mechanism |
|---|---|---|
| A copper matrix or copper-particle network containing graphene sheets; consolidation pressure can change pore volume, Cu-graphene contact, and sheet alignment. | Electrical conductivity is pressure-sensitive because pressure can alter the continuity and directional efficiency of the copper-graphene electron-transport network. | During consolidation, pressure can densify the material and reduce void- and interface-related resistance. It can also align graphene mainly perpendicular to the consolidation force, so conductivity can be anisotropic and higher along the graphene-plane direction. The result is not universally an increase: excessive deformation, graphene damage or agglomeration, and residual interfacial stress can add carrier-scattering sites. Confirm the pressure-conductivity response on the supplied grade and in the final test direction rather than treating it as a fixed material value. |
Compare Material Routes
Technical Guides
| Technical Guide | Summary |
|---|---|
| Graphene-Cu Phase Location, Copper Oxidation, Interface Resistance, and Matched-Control Qualification | Exact-intent Graphene Copper (Graphene-Cu) decision guide for locating graphene and copper phases, controlling oxidation and interfaces, and qualifying thermal and electrical claims against matched controls. |
| How CNT-Metal and Graphene-Metal Hybrids Change Crack Tolerance and Contact Formation | Determine whether a carbon-metal hybrid preserves contacts or redirects cracks without blocking metal necks, increasing residue, raising interface resistance, or weakening the aged joint. |
| Oxidation, Corrosion, and Galvanic Failure in Conductive Joints | Distinguish dry or gas-phase oxidation, electrolyte-mediated corrosion, galvanic coupling, and other interface aging by registering environment, contamination, metal and metallization chemistry, geometry, bias, products, material loss, resistance, and failure location. |
| Qualifying Conductive Interconnect Materials with Process, Reliability, and Change-Control Data | Qualify a conductive interconnect as a controlled material-process-joint system using incoming-lot, process-window, functional, reliability, traceability, and change-impact evidence; TDS, SDS, COA, or a single golden lot cannot establish application qualification alone. |
Documents & Inquiry
Document access follows the current approval state. Unapproved or unavailable files route to a document request instead of a public download.
Technical Data Sheet
Request required
Safety Data Sheet
Request required
Grade, Sample & Qualification Support
The Aurexene Materials Engineering Team can review the required form, host system, formulation or process, target, sample quantity, volume and timeline, and the grade-specific evidence needed before qualification.
Review Lab Capabilities for sample evaluation and qualification support, or Production Capabilities for scale-up, quality, documentation, and supply support.
Request Graphene-Cu Sample / Qualification Review