What is Nano Silver Paste?
Nano Silver Paste
For teams evaluating a nano silver paste supplier, Aurexene Materials offers a conductive silver paste family for printed electronics whose substrate, print method, cure conditions, geometry, and electrical targets must be matched to the selected grade.
Technical owner: Aurexene Materials Engineering Team
Nano Ag PasteSilver NanopasteLow-Temperature Silver Paste
Direct Answer
The family includes grade-specific screen-printing silver paste, conductive adhesive silver paste, and membrane-switch silver paste routes; each route requires its own exact-grade evidence and project qualification.
What It Is Not
- Nano Silver Paste is a formulated processing system, not loose Nano Ag Powder or an SWCNT-nano-Ag hybrid.
When Not to Use It
- Do not use Nano Silver Paste without matching the substrate, print method, cure window, line geometry, resistance target, adhesion, and reliability test to the exact grade.
Intrinsic Screening Summary
- Identity screen
- Silver-particle conductive paste; exact solids, vehicle, and additive package vary by grade; Grade-specific; confirm the selected grade's particle morphology from approved exact-grade evidence
- Material-level integration
- Match substrate, print method, cure window, line geometry, resistance target, adhesion, and reliability requirements before selecting a grade. Use the selected grade's approved evidence and project test for qualification.
Application Fit
| Application | Suitability | Conditions | Limitations |
|---|---|---|---|
| Printed Electronics Inks & Conductive Pastes | GOOD FIT | Brochure-listed routes: printed patterns, sensor electrodes, RFID, conductive repair, touch screens, keypads, conductive adhesive, and membrane circuits. | Confirm the exact grade, formulation, process conditions, performance, and reliability. |
| Electronic Packaging & Interconnects | GOOD FIT | Brochure-listed routes: HF-NSAG-130 packaging interconnects, with module-level or low-pressure silver sintering as emerging uses. | Confirm the exact grade, formulation, process conditions, performance, and reliability. |
Selection & Validation Framework
| Decision Question | Material-Level Answer |
|---|---|
| Substrate and print method | Identify the exact substrate and printing route. Brochure-listed compatibility is grade-specific, including ITO/PET fine-line screen printing and selected PET or PET/PC routes. Do not infer stencil printing or dispensing compatibility; confirm the selected grade with exact-grade evidence and a print trial. |
| Cure window | Define the substrate's allowable time-temperature window. There is no universal family-wide cure temperature. The 150°C for 40 minutes reference applies only to the brochure-listed conductive-adhesive grade and still requires exact-grade confirmation. |
| Line geometry and resistance | Provide line width, spacing, deposited thickness, and the required line, sheet, or volume-resistance target with its measurement method. Do not transfer brochure typical values across grades, geometries, substrates, cure profiles, or test methods. |
| Adhesion and reliability | Specify the adhesion method and relevant bend, humidity-bias, migration, thermal-cycle, or aging requirements. Final acceptance belongs to project testing in the intended substrate, geometry, cure, and service condition. |
Material Identity & Specification Status
Approved values for CAS / identity and Density are not published; confirm them during quotation or sample review.
Available Grades
| Grade | Form | Particle size | Purity | Typical use |
|---|---|---|---|---|
| HF-NSAG-40 | Paste | 40-60 nm | Confirm from the exact-grade TDS/COA | Printed conductive patterns, sensor electrodes, keypad and membrane circuits; RFID, flexible-PCB reinforcement traces, and conductive repair |
| HF-NSAG-130 | Paste | 130-150 nm | Confirm from the exact-grade TDS/COA | Thick-film conductive pastes, packaging interconnects, and coatings; Printed traces, contact electrodes, and shielding layers |
| Touch-screen silver paste | Low-temperature paste | Confirm formulated-grade acceptance from the exact-grade TDS/COA | Brochure-listed ITO/PET fine-line screen-printing route | |
| Potentiometer membrane silver paste | Low-temperature paste | Confirm formulated-grade acceptance from the exact-grade TDS/COA | Brochure-listed PET potentiometer-film route | |
| Keypad silver paste | Low-temperature paste | Confirm formulated-grade acceptance from the exact-grade TDS/COA | Brochure-listed PET keypad and button-membrane circuit route | |
| Conductive adhesive silver paste | Low-temperature paste | Confirm formulated-grade acceptance from the exact-grade TDS/COA | Brochure-listed printable conductive-adhesive route for PET/PC films | |
| Membrane switch silver paste | Low-temperature paste | Confirm formulated-grade acceptance from the exact-grade TDS/COA | Brochure-listed PET membrane-switch screen-printing route |
Brochure Grade Selection Data
Typical brochure values for product selection only. Final acceptance requires the selected grade's TDS, COA, and project test at the intended thickness, substrate, cure profile, and measurement method.
| Grade | Substrate | Process | Solids | Viscosity | Density | Electrical target | Qualification focus |
|---|---|---|---|---|---|---|---|
| Touch-screen silver paste | ITO/PET touch film | Fine-line screen printing | 76±2 wt.% typical | 250-350 poise typical | 2.5-3.0 g/cm3 typical | Sheet resistance <50 mΩ/□ typical target | Adhesion, sheet resistance, and cure window |
| Potentiometer membrane silver paste | PET potentiometer film | Conductive-track printing | 67±2 wt.% typical | 250-350 poise typical | 1.8-2.2 g/cm3 typical | Sheet resistance <40 mΩ/□ typical target | Resistance stability after heat and humidity exposure |
| Keypad silver paste | PET keypad membrane | Low-temperature screen printing | 42±2 wt.% typical | 250-350 poise typical | 1.8-2.2 g/cm3 typical | Sheet resistance <40 mΩ/□ typical target | Bending, adhesion, and continuity |
| Conductive adhesive silver paste | PET/PC films | Large-area conductive bonding | Confirm by exact-grade TDS/COA | 19 Pa·s typical (Brookfield DV2T, CPS1#, 18 RPM) | Confirm by exact-grade TDS/COA | Volume resistivity 1.0×10^-7 Ω·m typical target | Volume resistance, workability, and 150°C for 40 min typical cure reference |
| Membrane switch silver paste | PET membrane switch | High-volume screen printing | 63±2 wt.% typical | 250-350 poise typical | 1.8-2.2 g/cm3 typical | Sheet resistance <50 mΩ/□ typical target | Bending and storage stability |
Why It Works
| Structure | Function | Mechanism |
|---|---|---|
| Grade-specific silver-particle, vehicle, and additive formulation. | Provides a printable conductive route where particle contacts, solids, rheology, cure, and substrate adhesion are jointly controlled. | Conductivity and reliability depend on the selected grade, deposited thickness, substrate, cure, and test method; there is no universal family-wide cure temperature or finished-part specification. |
Compare Material Routes
| Material / Route | Decision Boundary |
|---|---|
| Nano Ag Powder | Nano Silver Paste is a formulated processing system containing silver particles, a vehicle, and grade-specific additives; Nano Ag Powder is a particulate raw material that requires formulation. Choose between a supplied paste route and a powder-formulation route without transferring paste processing claims to the powder or powder identity data to a finished paste. |
Technical Guides
| Technical Guide | Summary |
|---|---|
| Particle Contact, Flake Overlap, Network Percolation, and Sintered Neck Formation in Printed Traces | Particle Contact, Flake Overlap, Network Percolation, and Sintered Neck Formation in Printed Traces — a method-conditioned engineering guide for Printed Electronics Inks & Conductive Pastes covering structure-function behavior at the material, interface, and finished-system boundary, process limits, validation, and qualification boundaries. |
Documents & Inquiry
Document access follows the current approval state. Unapproved or unavailable files route to a document request instead of a public download.
Technical Data Sheet
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Safety Data Sheet
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Related resources
Grade, Sample & Qualification Support
The Aurexene Materials Engineering Team can review the required form, host system, formulation or process, target, sample quantity, volume and timeline, and the grade-specific evidence needed before qualification.
Review Lab Capabilities for sample evaluation and qualification support, or Production Capabilities for scale-up, quality, documentation, and supply support.
Request Nano Silver Paste Sample / Qualification Review