What is Nano Ni Powder?
Nano Ni Powder
Nano Ni Powder is nanoscale nickel powder with Ni chemical identity. Magnetic material context distinguishes its screening route from silver, copper, and tin nanopowders.
Technical owner: Aurexene Materials Engineering Team
Nano Nickel PowderNickel Nanopowder
What It Is Not
- Nano Ni Powder is standalone nanoscale nickel, not an SWCNT-nano-Ni hybrid.
When Not to Use It
- Do not use Nano Ni Powder when magnetic response, nickel restrictions, oxidation, or nickel-free requirements are incompatible with the application.
Intrinsic Screening Summary
- Identity screen
- Ni; Nanoscale nickel particles
Application Fit
| Application | Suitability | Conditions | Limitations |
|---|---|---|---|
| MLCC Internal-Electrode, Termination & Dielectric Materials | GOOD FIT | Brochure-listed routes: nickel paste for MLCC internal electrodes and internal-electrode development for MLCC or electronic ceramics. | Confirm the exact grade, oxide shell, formulation, firing conditions, electrode continuity, and reliability. |
| Conductive Plastics & Coatings | GOOD FIT | Brochure-listed routes: nickel conductive coatings and composite fillers. | Confirm the exact grade, oxide shell, formulation, process conditions, performance, and reliability. |
| EMI Shielding Materials | GOOD FIT | Brochure-listed routes: shielding coatings and shielding layers. | Confirm target-frequency shielding, grounding, oxide control, and environmental durability. |
| Electronic Packaging & Interconnects | CONDITIONAL | Emerging brochure routes: printable nickel electrodes and microelectronic interconnects. | This is an R&D route; project validation is required. |
Material Identity & Specification Status
Approved values for Packaging are not published; confirm them during quotation or sample review.
Available Grades
| Grade | Form | Particle size | Purity | Typical use | Availability |
|---|---|---|---|---|---|
| HF-NPNI-40 | Powder | 40-60 nm | Batch purity confirmed by COA/ICP report | MLCC internal-electrode paste screening; Thick-film electrodes and nickel conductive fillers | Request current grade availability |
| HF-NPNI-100 | Powder | 100-140 nm | Batch purity confirmed by COA/ICP report | Nickel conductive coatings, shielding layers, and composite fillers; Low-shrinkage nickel-paste and blend development | Request current grade availability |
| Property | Value |
|---|---|
| Composition | Ni |
| CAS / identity | 7440-02-0 |
| Morphology | Nanoscale nickel particles |
| Density | 8.90 g/cm3 intrinsic nickel density |
| Storage | Dry sealed container |
Compare Material Routes
Technical Guides
| Technical Guide | Summary |
|---|---|
| Adhesion, Die Shear, Peel, Cross-Section, and Fractography for Interconnect Qualification | Match the mechanical method to the package load path and use cross-sections and complete failure-surface allocation to determine whether a result represents joint cohesion, one interface, metallization, substrate, fixture, or mixed failure. |
| Atmosphere and Oxygen Control for Copper and Nickel Conductive Materials | Define the atmosphere at the material and joint through temperature, oxygen potential, moisture, gas composition, flow, pressure, leaks, organics, loading, cooling, and exposure—not from the nominal gas label or inlet reading. |
| Binder Burnout, Drying, and Organic Residue Control Before Sintering | Coordinate solvent removal, binder migration and decomposition, gas escape, atmosphere, and the onset of metal contact formation so drying or debinding does not create residue, voids, cracks, delamination, oxidation, or blocked interfaces. |
| CCTO Permittivity, Dielectric Loss, Leakage, and Internal-Barrier-Layer Behavior | Calcium Copper Titanate (CCTO) Permittivity, Dielectric Loss, Leakage, and Internal-Barrier-Layer Behavior — a method-conditioned engineering guide for MLCC Internal-Electrode, Termination & Dielectric Materials covering particle packing, surface oxide chemistry, shrinkage matching, grain-boundary behavior, and electrode-dielectric interface continuity, process limits, validation, and qualification boundaries. |
| Characterizing Nickel Powder, CCTO Powder, Pastes, Printed Layers, and Fired Microstructures | Characterizing Nickel Powder, Calcium Copper Titanate (CCTO) Powder, Pastes, Printed Layers, and Fired Microstructures — a method-conditioned engineering guide for MLCC Internal-Electrode, Termination & Dielectric Materials covering particle packing, surface oxide chemistry, shrinkage matching, grain-boundary behavior, and electrode-dielectric interface continuity, process limits, validation, and qualification boundaries. |
Documents & Inquiry
Document access follows the current approval state. Unapproved or unavailable files route to a document request instead of a public download.
Technical Data Sheet
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Safety Data Sheet
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Related resources
Grade, Sample & Qualification Support
The Aurexene Materials Engineering Team can review the required form, host system, formulation or process, target, sample quantity, volume and timeline, and the grade-specific evidence needed before qualification.
Review Lab Capabilities for sample evaluation and qualification support, or Production Capabilities for scale-up, quality, documentation, and supply support.
Request Nano Ni Powder Sample / Qualification Review