What is MXene?

MXenes (MXene)

MXene (Ti3C2Tx MXene family) for Conductive Materials and EMI Shielding Materials.

Technical owner: Aurexene Materials Engineering Team · Last updated: 2026-07-26

MXenesTi3C2 MXeneTi3C2Tx MXenetwo-dimensional carbideconductive 2D material

What It Is Not

  • MXene is not graphene; Ti3C2Tx is a surface-terminated two-dimensional transition-metal carbide family.

When Not to Use It

  • Do not use MXene when moisture, oxidation, long-storage stability, or surface-termination variability cannot be controlled.

Intrinsic Screening Summary

Identity screen
Ti3C2Tx (T = O, H, F, etc.); Two-dimensional flake morphology
Intrinsic feature
Published technical reference: "Highly conductive, breathable and magnetic MXene/Fe3O4/PEDOT:PSS coated carbon cloth for high-efficiency electromagnetic interference shielding".

Application Fit

Material Identity & Specification Status

Approved values for CAS / identity, Density, and Packaging are not published; confirm them during quotation or sample review.

PropertyValue
CompositionTi3C2Tx (T = O, H, F, etc.)
Particle sizePowder: 8.0 µm average; aqueous dispersion: 1-10 µm
MorphologyTwo-dimensional flake morphology
PurityAqueous dispersion: 0.5 ± 0.1 wt%
StoragePowder: dry sealed container. Aqueous dispersion: refrigerated storage.

Why It Works

StructureFunctionMechanism
Ti3C2Tx titanium carbide MXene; MXene phase powderMXene supports Conductive Materials, EMI Shielding Materials, ESD Materials.Published technical reference: "Highly conductive, breathable and magnetic MXene/Fe3O4/PEDOT:PSS coated carbon cloth for high-efficiency electromagnetic interference shielding".

Compare Material Routes

Technical Guides

Technical GuideSummary
A Dispersion Failure Root-Cause Map from Powder Receipt to Final Part PerformanceA Dispersion Failure Root-Cause Map from Powder Receipt to Final Part Performance — a method-conditioned engineering guide for Conductive Plastics & Coatings covering structure-function behavior at the material, interface, and finished-system boundary, process limits, validation, and qualification boundaries.
Abrasion and Chemical-Exposure Failure in Functional SurfacesAbrasion and Chemical-Exposure Failure in Functional Surfaces — a method-conditioned engineering guide for Conductive Plastics & Coatings covering structure-function behavior at the material, interface, and finished-system boundary, process limits, validation, and qualification boundaries.
Abrasion, Cleaning, and Chemical-Exposure Damage to ESD PerformanceA service-sequence qualification method that links defined abrasion, cleaning chemistry, rinse and dry conditions, surface damage, debris, and mapped ESD performance.
Absorption, Reflection, and Multiple-Reflection Contributions to EMI ShieldingSeparate incident-power reflection, material absorption, transmission, and internal interference before assigning an EMI shielding mechanism or comparing architectures.
Accelerated Settling, Centrifugation, Thermal Cycling, and Freeze-Thaw Tests vs Real Shelf StabilityAccelerated Settling, Centrifugation, Thermal Cycling, and Freeze-Thaw Tests vs Real Shelf Stability — a method-conditioned engineering guide for Conductive Plastics & Coatings covering structure-function behavior at the material, interface, and finished-system boundary, process limits, validation, and qualification boundaries.

Documents & Inquiry

Document access follows the current approval state. Unapproved or unavailable files route to a document request instead of a public download.

Related resources

Grade, Sample & Qualification Support

The Aurexene Materials Engineering Team can review the required form, host system, formulation or process, target, sample quantity, volume and timeline, and the grade-specific evidence needed before qualification.

Review Lab Capabilities for sample evaluation and qualification support, or Production Capabilities for scale-up, quality, documentation, and supply support.

Request MXene Sample / Qualification Review