What is CNTxGNP?
CNT x GNP (CNTxGNP)
CNTxGNP is a hybrid carbon nanotube and graphene nanoplatelet material platform for conductive, EMI shielding, ESD, thermal management, carbon dispersion, and electrothermal applications.
Technical owner: Aurexene Materials Engineering Team · Last updated: 2026-07-25
What It Is Not
- CNTxGNP is not CNT or graphene nanoplatelet alone; it is a hybrid conductive-filler architecture.
When Not to Use It
- Do not use CNTxGNP when the process cannot control both nanotube dispersion and platelet orientation, or when a single-filler system is required.
Intrinsic Screening Summary
- Identity screen
- Carbon nanotube and graphene nanoplatelet hybrid; Hybrid CNT and graphene nanoplatelet network
- Intrinsic feature
- CNTs and platelet graphene can create complementary network paths when dispersion, orientation, and loading are controlled.
Application Fit
Material Identity & Specification Status
Approved values for CAS / identity, Particle size, Density, Purity, and Packaging are not published; confirm them during quotation or sample review.
| Property | Value |
|---|---|
| Composition | Carbon nanotube and graphene nanoplatelet hybrid |
| Morphology | Hybrid CNT and graphene nanoplatelet network |
| Storage | Powder: keep dry and sealed. Paste: store factory-sealed at 5–50 °C and ambient humidity ≤95% RH; shelf life is 6 months from the production date under these storage conditions. |
Why It Works
| Structure | Function | Mechanism |
|---|---|---|
| Carbon nanotube network combined with graphene nanoplatelets. | CNTxGNP supports conductive, shielding, static-control, thermal, dispersion, and electrothermal material screening. | CNTs and platelet graphene can create complementary network paths when dispersion, orientation, and loading are controlled. |
Compare Material Routes
| Material / Route | Decision Boundary |
|---|---|
| hBNxCNT | CNTxGNP is the carbon-carbon hybrid route when conductive or electrothermal behavior is part of the target. Electrical conductivity, opacity, viscosity, and dispersion risk must fit the application boundary. |
Technical Guides
| Technical Guide | Summary |
|---|---|
| Aspect Ratio, Porosity, Contact Resistance, and Electronic Path Continuity in Electrodes | Electrode continuity depends on the processed distribution of additive length scales, accessible pore structure, particle and collector contacts, direction, and cycling state; high powder aspect ratio or low total resistance alone cannot prove a robust electronic path. |
| Chemical Oxidation, Corrosion, and Conductivity Drift in Cell Environments | Chemical Oxidation, Corrosion, and Conductivity Drift in Cell Environments — a method-conditioned engineering guide for Bipolar Plates covering structure-function behavior at the material, interface, and finished-system boundary, process limits, validation, and qualification boundaries. |
| Compression Molding, Injection Molding, Extrusion, and Plate-Density Control | Compression Molding, Injection Molding, Extrusion, and Plate-Density Control — a method-conditioned engineering guide for Bipolar Plates covering structure-function behavior at the material, interface, and finished-system boundary, process limits, validation, and qualification boundaries. |
| Conductivity, Corrosion, Gas Permeability, Strength, and Manufacturability Tradeoffs | Conductivity, Corrosion, Gas Permeability, Strength, and Manufacturability Tradeoffs — a method-conditioned engineering guide for Bipolar Plates covering structure-function behavior at the material, interface, and finished-system boundary, process limits, validation, and qualification boundaries. |
| Conductivity Loss from Abrasion, Ozone, Heat, Oil, and Chemical Exposure | Conductivity Loss from Abrasion, Ozone, Heat, Oil, and Chemical Exposure — a method-conditioned engineering guide for Conductive Rubber/Tire/Elastomers covering structure-function behavior at the material, interface, and finished-system boundary, process limits, validation, and qualification boundaries. |
FAQ
What TI topics does CNTxGNP belong to?
CNTxGNP is mapped to Hybrid Nanofillers, Carbon Dispersion, Conductive Additives, EMI Shielding, ESD Protection, Thermal Management, Heat Dissipation Fillers, Hybrid Thermal-Conductive Fillers, Photothermal / Electrothermal Materials, Polymer Composite Additives, Graphene / GNP Additives, CNT Composite Additives.
Documents & Inquiry
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Technical Data Sheet
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Safety Data Sheet
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Grade, Sample & Qualification Support
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