Koleksi berpusat pada aplikasi
Technical Insights yang diterbitkan dikelompokkan di sekitar Electronic Packaging & Interconnects, diurutkan menurut tahapan rekayasa dari pemilihan hingga kualifikasi.
Bulk Additive vs Functional Coating vs Surface Treatment: Choosing System Placement — panduan rekayasa berbasis metode untuk Electronic Packaging & Interconnects yang membahas perilaku struktur–fungsi pada batas material, antarmuka, dan sistem akhir, beserta batas proses, validasi, dan kualifikasi.
Bulk Composite vs Coating vs Film: Choosing Geometry Before Choosing a Material — panduan rekayasa berbasis metode untuk Electronic Packaging & Interconnects yang membahas perilaku struktur–fungsi pada batas material, antarmuka, dan sistem akhir, beserta batas proses, validasi, dan kualifikasi.
Decision guide for balancing thermally conductive filler loading against flow, cure, CTE, modulus, and electrical-insulation requirements in epoxy molding compounds.
How to Compare Supplier Claims When Methods, Units, Geometry, and Conditions Differ — panduan rekayasa berbasis metode untuk Electronic Packaging & Interconnects yang membahas perilaku struktur–fungsi pada batas material, antarmuka, dan sistem akhir, beserta batas proses, validasi, dan kualifikasi.
Bondline Porosity, Contact Resistance, Interfacial Thermal Resistance, and Power-Device Performance — panduan rekayasa berbasis metode untuk Silver & Copper Sintering Die-Attach Materials yang membahas perilaku struktur–fungsi pada batas material, antarmuka, dan sistem akhir, beserta batas proses, validasi, dan kualifikasi.
Locate the constriction or interface that concentrates current and heat, then separate bulk, contact, geometry, and aging contributions before assigning resistance growth to a conductive material.
Determine whether a carbon-metal hybrid preserves contacts or redirects cracks without blocking metal necks, increasing residue, raising interface resistance, or weakening the aged joint.
Connect powder packing, binder removal, particle rearrangement, neck growth, pore evolution, interface contact, and thermal history to the electrical and mechanical continuity of conductive interconnects.
How Particle Size, Shape, Packing, and Surface Chemistry Control Bondline Densification — panduan rekayasa berbasis metode untuk Silver & Copper Sintering Die-Attach Materials yang membahas perilaku struktur–fungsi pada batas material, antarmuka, dan sistem akhir, beserta batas proses, validasi, dan kualifikasi.
How Shear Thinning and Thixotropic Recovery Affect Coating, Printing, Pumping, and Molding — panduan rekayasa berbasis metode untuk Conductive Plastics & Coatings yang membahas perilaku struktur–fungsi pada batas material, antarmuka, dan sistem akhir, beserta batas proses, validasi, dan kualifikasi.
How Silver and Copper Sintering Build Electrical and Thermal Paths in Die-Attach Bondlines — panduan rekayasa berbasis metode untuk Silver & Copper Sintering Die-Attach Materials yang membahas perilaku struktur–fungsi pada batas material, antarmuka, dan sistem akhir, beserta batas proses, validasi, dan kualifikasi.
Separate silver, copper, nickel, and tin surface chemistry before selecting storage, paste chemistry, atmosphere, debinding, thermal profile, and interface controls for conductive joints.
System-boundary guide for allocating thermal resistance, heat spreading, CTE mismatch, warpage, and interface qualification across advanced packaging stacks.
Relate the measured particle and agglomerate population to packing, surface chemistry, organics demand, neck growth, pore and shrinkage evolution, interface contact, and retained interconnect resistance.
Define the atmosphere at the material and joint through temperature, oxygen potential, moisture, gas composition, flow, pressure, leaks, organics, loading, cooling, and exposure—not from the nominal gas label or inlet reading.
Atmosphere, Surface-Oxide, Drying, and Organic-Residue Control in Copper and Silver Sintering — panduan rekayasa berbasis metode untuk Silver & Copper Sintering Die-Attach Materials yang membahas perilaku struktur–fungsi pada batas material, antarmuka, dan sistem akhir, beserta batas proses, validasi, dan kualifikasi.
Coordinate solvent removal, binder migration and decomposition, gas escape, atmosphere, and the onset of metal contact formation so drying or debinding does not create residue, voids, cracks, delamination, oxidation, or blocked interfaces.
Formulate backward from the selected transfer process and final joint, because screen printing, stencil printing, dispensing, and bonding impose different flow, recovery, release, geometry, drying, and contact requirements.
Formulating Silver and Copper Sinter Pastes for Printing, Stenciling, and Dispensing — panduan rekayasa berbasis metode untuk Silver & Copper Sintering Die-Attach Materials yang membahas perilaku struktur–fungsi pada batas material, antarmuka, dan sistem akhir, beserta batas proses, validasi, dan kualifikasi.
How Coating and Printing Methods Change the Acceptable Particle and Rheology Window — panduan rekayasa berbasis metode untuk Conductive Plastics & Coatings yang membahas perilaku struktur–fungsi pada batas material, antarmuka, dan sistem akhir, beserta batas proses, validasi, dan kualifikasi.
Qualify the complete metallization stack and both interface histories, because cleanliness, oxide, finish, thickness, topography, preparation, storage, wetting, reaction, contact area, and failure location jointly control package adhesion and contact resistance.
Choose pressureless or pressure-assisted processing from the package temperature, stress, geometry, throughput, contact, pore, interface, and reliability window—not from a nominal peak temperature or coupon density alone.
Pressureless vs Pressure-Assisted Sintering for Die-Attach Assemblies — panduan rekayasa berbasis metode untuk Silver & Copper Sintering Die-Attach Materials yang membahas perilaku struktur–fungsi pada batas material, antarmuka, dan sistem akhir, beserta batas proses, validasi, dan kualifikasi.
Diagnose thermomechanical failure from the constrained material stack, geometry, modulus and time dependence, process shrinkage, thermal gradients, cooling, residual state, and crack path—not from CTE difference alone.
