Choosing hBN for epoxy adhesives: a balance of heat conduction, viscosity and adhesion
Hexagonal Boron Nitride (hBN) is the primary screening material. For a practical review of hBN thermal fillers for epoxy adhesives, comparing product names or supplier representative figures alone is not sufficient. First, the required functions of the final part or film, acceptable appearance and processing range, and actual test conditions must be defined. Then, candidate materials must be compared under the same base material, thickness, process, and conditioning conditions to obtain meaningful conclusions.