What is AX-DND?
AX-DND Diamond Materials
AX-DND is an evaluation-stage diamond material family for controlled thermal-interface, polymer, electronic-packaging, and nanofluid formulation development.
Technical owner: Aurexene Materials Engineering Team · Last updated: 2026-08-10
Diamond PowderNanodiamondDetonation NanodiamondDNDDiamond Thermal Filler
Quick Answer
AX-DND is a diamond and nanodiamond development family for controlled screening in solid thermal-interface or polymer formulations and, separately, in engineered water/glycol nanofluid studies. It has not been qualified as a coolant, TIM, underfill, cold-plate material, immersion fluid, or for any GPU/HBM platform.
What It Is Not
- AX-DND is not a qualified coolant, drop-in cold-plate fluid, immersion fluid, cold-plate body, or approved GPU/HBM platform material.
- Powder or dispersion identity does not establish a finished TIM, underfill, encapsulant, heat spreader, or cooling-loop result.
- AX-DND is distinct from bulk CVD diamond plates and fully consolidated copper-diamond heat spreaders.
When Not to Use It
- Do not use AX-DND when the program requires a production-qualified coolant or finished package result without formulation-, component-, and loop-level evidence.
Intrinsic Screening Summary
- Identity screen
- Carbon in the diamond allotrope, with form-specific surface functionality, non-diamond carbon, metals, moisture, additives, and carrier defined by the selected grade.; Diamond nanoparticles that may form aggregates; surface treatment and aggregation state vary by selected form.
- Intrinsic feature
- Heat is carried through the diamond lattice by phonons. In a powder-filled composite or particle-loaded fluid, interparticle contact, interfaces, surface chemistry, aggregation, loading, orientation, and the host phase govern the realized result.
- Material-level integration
- Fix diamond form, surface chemistry, primary and agglomerate distributions, non-diamond carbon, metals, moisture, additives, and carrier before formulation work. Every powder, polymer-composite, TIM, encapsulant, or fluid study.
Application Fit
| Application | Suitability | Conditions | Limitations |
|---|---|---|---|
| Heat Dissipation | CONDITIONAL | Controlled screening as a diamond-filled solid thermal-interface constituent or in a separately engineered water/glycol nanofluid study. | No AX-DND thermal, hydraulic, component, GPU, HBM, cold-plate, or loop qualification is established. A particle-loaded fluid must be approved as a dedicated R&D architecture rather than assumed compatible with a conventional low-solids loop. |
| Thermally Conductive & Electrically Insulating Polymers | CONDITIONAL | Diamond-particle filler screen in a polymer, adhesive, potting, or solid thermal-interface formulation where thermal transport and electrical insulation are both measured. | Qualify surface chemistry, loading, packing, viscosity, cure, voids, through-plane transport, dielectric behavior, mechanical retention, and thermal cycling in the finished formulation. |
| Electronic Packaging & Interconnects | CONDITIONAL | Diamond-filled TIM, underfill, encapsulant, molding-compound, or other insulating package-heat-path formulation study. | Do not infer package suitability from loose powder. Qualify ionic purity, dielectric behavior, CTE, modulus, cure, rheology, voids, adhesion, moisture, warpage, thermal cycling, and the complete package-to-cold-plate path. |
Selection & Validation Framework
| Decision Question | Material-Level Answer |
|---|---|
| Solid-interface formulation | Screen particle packing, wetting, loading, rheology, mixing, degassing, cure, bond-line thickness, contact resistance, dielectric behavior, CTE, adhesion, and cycling in the complete formulation. TIM, adhesive, underfill, encapsulant, potting, or thermally conductive polymer development. |
| Particle-loaded fluid study | Treat stability, redispersion, viscosity, specific heat, thermal conductivity, pressure drop, filtration, deposition, fouling, erosion, corrosion, seals, polymers, cleanliness, and aging as coupled loop requirements. Dedicated water/glycol R&D loop with owner and OEM approval for particle loading. |
Material Identity & Specification Status
| Property | Value | Method |
|---|---|---|
| Composition | Carbon in the diamond allotrope, with form-specific surface functionality, non-diamond carbon, metals, moisture, additives, and carrier defined by the selected grade. | |
| CAS / identity | 7782-40-3 | |
| Particle size | Nanometer primary particles in detonation-nanodiamond forms; agglomerate, aggregate, and dispersion distributions vary by grade and measurement method. | |
| Morphology | Diamond nanoparticles that may form aggregates; surface treatment and aggregation state vary by selected form. | |
| Density | 3.51 g/cm3 crystalline-diamond reference density; powder bulk density and dispersion density vary by form. | |
| Purity | Grade-specific diamond carbon, non-diamond carbon, metal, moisture, and surface-functional-group limits are disclosed during sample qualification. | |
| Packaging | Sealed powder packaging or a carrier-compatible dispersion container selected during quotation. | |
| Storage | Store in the unopened form-specific container under the current handling document; carrier and surface-treatment conditions vary by grade. | |
| CAS Number | 7782-40-3 | Diamond identity |
| Reference density | 3.51 g/cm3 | Crystalline-diamond reference; not powder bulk or dispersion density |
Functional Performance
| Property | Value | Conditions |
|---|---|---|
| Thermal transport potential | Formulation-dependent | Measure the finished composite, interface, or fluid under the intended geometry, temperature, loading, and aging conditions. Intrinsic diamond behavior does not establish bulk-composite, interface, coolant, cold-plate, or device performance. |
| Electrical insulation potential | Grade- and formulation-dependent | Measure dielectric strength, volume resistivity, leakage, and ionic contamination in the finished system. Non-diamond carbon, metals, surface chemistry, carrier, moisture, and the host formulation can change electrical behavior. |
Why It Works
| Structure | Function | Mechanism |
|---|---|---|
| sp3-bonded diamond carbon lattice | High intrinsic thermal-transport potential with electrical-insulation potential in a controlled material system. | Heat is carried through the diamond lattice by phonons. In a powder-filled composite or particle-loaded fluid, interparticle contact, interfaces, surface chemistry, aggregation, loading, orientation, and the host phase govern the realized result. |
Technical Guides
| Technical Guide | Summary |
|---|---|
| Bond-Line Thickness, Contact Pressure, and Surface Roughness in Thermal Interfaces | An assembly-level method for separating bulk-layer resistance from two contact interfaces while controlling bond-line thickness, pressure, surface topography, coverage, aging, and mechanical retention. |
| Controlling Voids and Porosity in Thermal Adhesives, Encapsulants, Pads, and Composites | A defect-control method that distinguishes air, moisture, volatiles, wetting, cure, delivery, and assembly causes, then verifies void location and finished thermal-interface response. |
| Managing High Filler Loading, Viscosity, Mixing Torque, and Moldability | Managing High Filler Loading, Viscosity, Mixing Torque, and Moldability — a method-conditioned engineering guide for Thermally Conductive & Electrically Insulating Polymers covering structure-function behavior at the material, interface, and finished-system boundary, process limits, validation, and qualification boundaries. |
| Thermal-Path and CTE Boundaries in Chiplet, 2.5D/3D, Fan-Out, Interposer, Underfill, Die-Attach, and Molding-Compound Stacks | System-boundary guide for allocating thermal resistance, heat spreading, CTE mismatch, warpage, and interface qualification across advanced packaging stacks. |
FAQ
Can AX-DND cool GPU and HBM packages?
It may be evaluated in the solid package-to-cold-plate heat path or in a separately engineered nanofluid study. It is not a qualified GPU/HBM coolant, and the exact formulation, package, cold plate, loop, and OEM requirements must be validated.
Is AX-DND a drop-in water or glycol coolant?
No. Particle-loaded fluids add stability, viscosity, pressure-drop, filtration, deposition, fouling, erosion, corrosion, materials-compatibility, cleanliness, aging, serviceability, and warranty requirements.
Can AX-DND be used in a thermal interface material?
Diamond-filled polymers and encapsulants have material-class research precedent. An AX-DND formulation still needs exact-grade, loading, rheology, cure, bond-line, interface-resistance, dielectric, mechanical, moisture, and cycling evidence.
Documents & Inquiry
Document access follows the current approval state. Unapproved or unavailable files route to a document request instead of a public download.
Technical Data Sheet
Request required
Safety Data Sheet
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Grade, Sample & Qualification Support
The Aurexene Materials Engineering Team can review the required form, host system, formulation or process, target, sample quantity, volume and timeline, and the grade-specific evidence needed before qualification.
Review Lab Capabilities for sample evaluation and qualification support, or Production Capabilities for scale-up, quality, documentation, and supply support.
Request AX-DND Sample / Qualification Review