What is AX-DND?
AX-DND Diamond Materials
AX-DND is an evaluation-stage diamond material family for controlled thermal-interface, polymer, electronic-packaging, and nanofluid formulation development.
Technical owner: Aurexene Materials Engineering Team · Last updated: 2026-08-10
Quick Answer
AX-DND is a diamond and nanodiamond development family for controlled screening in solid thermal-interface or polymer formulations and, separately, in engineered water/glycol nanofluid studies. It has not been qualified as a coolant, TIM, underfill, cold-plate material, immersion fluid, or for any GPU/HBM platform.
What It Is Not
- AX-DND is not a qualified coolant, drop-in cold-plate fluid, immersion fluid, cold-plate body, or approved GPU/HBM platform material.
- Powder or dispersion identity does not establish a finished TIM, underfill, encapsulant, heat spreader, or cooling-loop result.
- AX-DND is distinct from bulk CVD diamond plates and fully consolidated copper-diamond heat spreaders.
When Not to Use It
- Do not use AX-DND when the program requires a production-qualified coolant or finished package result without formulation-, component-, and loop-level evidence.
Intrinsic Screening Summary
- Identity screen
- Carbon in the diamond allotrope, with form-specific surface functionality, non-diamond carbon, metals, moisture, additives, and carrier defined by the selected grade.; Diamond nanoparticles that may form aggregates; surface treatment and aggregation state vary by selected form.
- Intrinsic feature
- Heat is carried through the diamond lattice by phonons. In a powder-filled composite or particle-loaded fluid, interparticle contact, interfaces, surface chemistry, aggregation, loading, orientation, and the host phase govern the realized result.
- Material-level integration
- Fix diamond form, surface chemistry, primary and agglomerate distributions, non-diamond carbon, metals, moisture, additives, and carrier before formulation work. Every powder, polymer-composite, TIM, encapsulant, or fluid study.
Application Fit
| Application | Suitability | Conditions | Limitations |
|---|---|---|---|
| Heat Dissipation | CONDITIONAL | Controlled screening as a diamond-filled solid thermal-interface constituent or in a separately engineered water/glycol nanofluid study. | No AX-DND thermal, hydraulic, component, GPU, HBM, cold-plate, or loop qualification is established. A particle-loaded fluid must be approved as a dedicated R&D architecture rather than assumed compatible with a conventional low-solids loop. |
| Thermally Conductive & Electrically Insulating Polymers | CONDITIONAL | Diamond-particle filler screen in a polymer, adhesive, potting, or solid thermal-interface formulation where thermal transport and electrical insulation are both measured. | Qualify surface chemistry, loading, packing, viscosity, cure, voids, through-plane transport, dielectric behavior, mechanical retention, and thermal cycling in the finished formulation. |
| Electronic Packaging & Interconnects | CONDITIONAL | Diamond-filled TIM, underfill, encapsulant, molding-compound, or other insulating package-heat-path formulation study. | Do not infer package suitability from loose powder. Qualify ionic purity, dielectric behavior, CTE, modulus, cure, rheology, voids, adhesion, moisture, warpage, thermal cycling, and the complete package-to-cold-plate path. |
Selection & Validation Framework
| Decision Question | Material-Level Answer |
|---|---|
| Solid-interface formulation | Screen particle packing, wetting, loading, rheology, mixing, degassing, cure, bond-line thickness, contact resistance, dielectric behavior, CTE, adhesion, and cycling in the complete formulation. TIM, adhesive, underfill, encapsulant, potting, or thermally conductive polymer development. |
| Particle-loaded fluid study | Treat stability, redispersion, viscosity, specific heat, thermal conductivity, pressure drop, filtration, deposition, fouling, erosion, corrosion, seals, polymers, cleanliness, and aging as coupled loop requirements. Dedicated water/glycol R&D loop with owner and OEM approval for particle loading. |
| Solid thermal-interface or package formulation | Required for: Heat Dissipation, Thermally Conductive & Electrically Insulating Polymers, and Electronic Packaging & Interconnects. Measure: Exact material identity and particle/agglomerate distributions; Loading, packing, rheology, mixing, degassing, and cure; Through-plane thermal conductivity and interface resistance; Bond-line thickness, pressure, pump-out, dry-out, and voids; Dielectric behavior, ionic purity, CTE, modulus, adhesion, moisture, and cycling. Sample state: Final formulation and representative package or interface geometry. Failure signals: High intrinsic conductivity does not reduce system thermal resistance.; Viscosity, voids, bond-line, dielectric, CTE, adhesion, or aging leaves acceptance.. |
| Dedicated particle-loaded fluid R&D loop | Required for: Heat Dissipation. Measure: Exact carrier, additives, loading, primary particle and agglomerate distributions; Stability, settling, redispersion, viscosity, density, pH, and electrical conductivity; Thermal conductivity, specific heat, pressure drop, flow, and pumping burden across temperature; Filtration, deposition, fouling, erosion, corrosion, and wetted-material compatibility; Loop cleanliness, aging, thermal cycling, serviceability, and OEM approval. Sample state: Exact formulation in representative cold plate, CDU, tubing, seals, and filtration hardware. Failure signals: Agglomeration, filter loading, pressure-drop rise, flow loss, deposition, fouling, erosion, corrosion, contamination, or warranty conflict.. |
Material Identity & Specification Status
Approved values for Packaging are not published; confirm them during quotation or sample review.
| Property | Value | Method |
|---|---|---|
| Composition | Carbon in the diamond allotrope, with form-specific surface functionality, non-diamond carbon, metals, moisture, additives, and carrier defined by the selected grade. | |
| CAS / identity | 7782-40-3 | |
| Particle size | Nanometer primary particles in detonation-nanodiamond forms; agglomerate, aggregate, and dispersion distributions vary by grade and measurement method. | |
| Morphology | Diamond nanoparticles that may form aggregates; surface treatment and aggregation state vary by selected form. | |
| Density | 3.51 g/cm3 crystalline-diamond reference density; powder bulk density and dispersion density vary by form. | |
| Purity | Grade-specific diamond carbon, non-diamond carbon, metal, moisture, and surface-functional-group limits are disclosed during sample qualification. | |
| Storage | Store in the unopened form-specific container under the current handling document; carrier and surface-treatment conditions vary by grade. | |
| CAS Number | 7782-40-3 | Diamond identity |
| Reference density | 3.51 g/cm3 | Crystalline-diamond reference; not powder bulk or dispersion density |
Functional Performance
| Property | Value | Conditions |
|---|---|---|
| Thermal transport potential | Formulation-dependent | Measure the finished composite, interface, or fluid under the intended geometry, temperature, loading, and aging conditions. Intrinsic diamond behavior does not establish bulk-composite, interface, coolant, cold-plate, or device performance. |
| Electrical insulation potential | Grade- and formulation-dependent | Measure dielectric strength, volume resistivity, leakage, and ionic contamination in the finished system. Non-diamond carbon, metals, surface chemistry, carrier, moisture, and the host formulation can change electrical behavior. |
Why It Works
| Structure | Function | Mechanism |
|---|---|---|
| sp3-bonded diamond carbon lattice | High intrinsic thermal-transport potential with electrical-insulation potential in a controlled material system. | Heat is carried through the diamond lattice by phonons. In a powder-filled composite or particle-loaded fluid, interparticle contact, interfaces, surface chemistry, aggregation, loading, orientation, and the host phase govern the realized result. |
Technical Guides
| Technical Guide | Summary |
|---|---|
| Bond-Line Thickness, Contact Pressure, and Surface Roughness in Thermal Interfaces | An assembly-level method for separating bulk-layer resistance from two contact interfaces while controlling bond-line thickness, pressure, surface topography, coverage, aging, and mechanical retention. |
| Controlling Voids and Porosity in Thermal Adhesives, Encapsulants, Pads, and Composites | A defect-control method that distinguishes air, moisture, volatiles, wetting, cure, delivery, and assembly causes, then verifies void location and finished thermal-interface response. |
| Managing High Filler Loading, Viscosity, Mixing Torque, and Moldability | Managing High Filler Loading, Viscosity, Mixing Torque, and Moldability — a method-conditioned engineering guide for Thermally Conductive & Electrically Insulating Polymers covering structure-function behavior at the material, interface, and finished-system boundary, process limits, validation, and qualification boundaries. |
| Thermal-Path and CTE Boundaries in Chiplet, 2.5D/3D, Fan-Out, Interposer, Underfill, Die-Attach, and Molding-Compound Stacks | System-boundary guide for allocating thermal resistance, heat spreading, CTE mismatch, warpage, and interface qualification across advanced packaging stacks. |
FAQ
Can AX-DND cool GPU and HBM packages?
It may be evaluated in the solid package-to-cold-plate heat path or in a separately engineered nanofluid study. It is not a qualified GPU/HBM coolant, and the exact formulation, package, cold plate, loop, and OEM requirements must be validated.
Is AX-DND a drop-in water or glycol coolant?
No. Particle-loaded fluids add stability, viscosity, pressure-drop, filtration, deposition, fouling, erosion, corrosion, materials-compatibility, cleanliness, aging, serviceability, and warranty requirements.
Can AX-DND be used in a thermal interface material?
Diamond-filled polymers and encapsulants have material-class research precedent. An AX-DND formulation still needs exact-grade, loading, rheology, cure, bond-line, interface-resistance, dielectric, mechanical, moisture, and cycling evidence.
Commercial Availability
Supplier role: Request confirmation
Supply status: Request confirmation
Sample status: Sample availability requires confirmation
Commercial details are not published until the source and verification fields are complete and the Supplier Data Packet is signed by the sales owner, technical reviewer, and resource/compliance owner. Request current grade, form, sample, packaging, and delivery confirmation.
Documents & Inquiry
Document access follows the current approval state. Unapproved or unavailable files route to a document request instead of a public download.
Technical Data Sheet
Request required
Safety Data Sheet
Request required
Grade, Sample & Qualification Support
The Aurexene Materials Engineering Team can review the required form, host system, formulation or process, target, sample quantity, volume and timeline, and the grade-specific evidence needed before qualification.
Review Lab Capabilities for sample evaluation and qualification support, or Production Capabilities for scale-up, quality, documentation, and supply support.
Request AX-DND Sample / Qualification Review