Application-first collection

Eletrodo interno, terminação e materiais dielétricos MLCC

Published Technical Insights grouped around MLCC Internal-Electrode, Termination & Dielectric Materials, ordered by the engineering sequence from selection through qualification.

CCTO Permissividade, perda dielétrica, vazamento e comportamento da camada de barreira interna

Calcium Copper Titanate (CCTO) Permittivity, Dielectric Loss, Leakage, and Internal-Barrier-Layer Behavior — a method-conditioned engineering guide for MLCC Internal-Electrode, Termination & Dielectric Materials covering particle packing, surface oxide chemistry, shrinkage matching, grain-boundary behavior, and electrode-dielectric interface continuity, process limits, validation, and qualification boundaries.

Ler conteúdo

Correspondência de contração eletrodo-dielétrico durante a queima do ligante, co-queima e reoxidação

Electrode–Dielectric Shrinkage Matching During Binder Burnout, Co-Firing, and Reoxidation — a method-conditioned engineering guide for MLCC Internal-Electrode, Termination & Dielectric Materials covering particle packing, surface oxide chemistry, shrinkage matching, grain-boundary behavior, and electrode-dielectric interface continuity, process limits, validation, and qualification boundaries.

Ler conteúdo

Como o tamanho das partículas de níquel, a morfologia e o empacotamento controlam a continuidade do eletrodo interno do MLCC

How Nickel Particle Size, Morphology, and Packing Control MLCC Internal-Electrode Continuity — a method-conditioned engineering guide for MLCC Internal-Electrode, Termination & Dielectric Materials covering particle packing, surface oxide chemistry, shrinkage matching, grain-boundary behavior, and electrode-dielectric interface continuity, process limits, validation, and qualification boundaries.

Ler conteúdo

Óxido de superfície de níquel, carbono, humidade e impurezas durante a queima do eletrodo MLCC

Nickel Surface Oxide, Carbon, Moisture, and Impurities During MLCC Electrode Firing — a method-conditioned engineering guide for MLCC Internal-Electrode, Termination & Dielectric Materials covering particle packing, surface oxide chemistry, shrinkage matching, grain-boundary behavior, and electrode-dielectric interface continuity, process limits, validation, and qualification boundaries.

Ler conteúdo

Controlo de reologia de pasta, impressão em folhas verdes, empilhamento, laminação, queima e coqueima

Controlling Paste Rheology, Green-Sheet Printing, Stacking, Lamination, Burnout, and Co-Firing — a method-conditioned engineering guide for MLCC Internal-Electrode, Termination & Dielectric Materials covering particle packing, surface oxide chemistry, shrinkage matching, grain-boundary behavior, and electrode-dielectric interface continuity, process limits, validation, and qualification boundaries.

Ler conteúdo

Dispersão e Sinterização CCTO Pós dielétricos sem aglomeração ou crescimento anormal de grãos

Dispersing and Sintering Calcium Copper Titanate (CCTO) Dielectric Powders Without Agglomeration or Abnormal Grain Growth — a method-conditioned engineering guide for MLCC Internal-Electrode, Termination & Dielectric Materials covering particle packing, surface oxide chemistry, shrinkage matching, grain-boundary behavior, and electrode-dielectric interface continuity, process limits, validation, and qualification boundaries.

Ler conteúdo

Dispersão de óxidos hidrofílicos e cerâmicas em polímeros não polares e sistemas solventes

Dispersing Hydrophilic Oxides and Ceramics into Nonpolar Polymers and Solvent Systems — a method-conditioned engineering guide for Conductive Plastics & Coatings covering structure-function behavior at the material, interface, and finished-system boundary, process limits, validation, and qualification boundaries.

Ler conteúdo

Dispersão de pó de níquel ultrafino para pastas de eletrodo interno MLCC

Dispersing Ultrafine Nickel Powder for MLCC Internal-Electrode Pastes — a method-conditioned engineering guide for MLCC Internal-Electrode, Termination & Dielectric Materials covering particle packing, surface oxide chemistry, shrinkage matching, grain-boundary behavior, and electrode-dielectric interface continuity, process limits, validation, and qualification boundaries.

Ler conteúdo

Delaminação, rachaduras, curtos-circuitos, vazamentos e falhas de resistência ao isolamento em estruturas MLCC

Delamination, Cracking, Shorts, Leakage, and Insulation-Resistance Failure in MLCC Structures — a method-conditioned engineering guide for MLCC Internal-Electrode, Termination & Dielectric Materials covering particle packing, surface oxide chemistry, shrinkage matching, grain-boundary behavior, and electrode-dielectric interface continuity, process limits, validation, and qualification boundaries.

Ler conteúdo

Diagnosticando descontinuidade de eletrodo de níquel, estreitamento, aglomerados e alta resistência em série

Diagnosing Nickel-Electrode Discontinuity, Necking, Agglomerates, and High Series Resistance — a method-conditioned engineering guide for MLCC Internal-Electrode, Termination & Dielectric Materials covering particle packing, surface oxide chemistry, shrinkage matching, grain-boundary behavior, and electrode-dielectric interface continuity, process limits, validation, and qualification boundaries.

Ler conteúdo

Caracterização de Pó de Níquel, Pó CCTO, Pastas, Camadas Impressas e Microestruturas Queimadas

Characterizing Nickel Powder, Calcium Copper Titanate (CCTO) Powder, Pastes, Printed Layers, and Fired Microstructures — a method-conditioned engineering guide for MLCC Internal-Electrode, Termination & Dielectric Materials covering particle packing, surface oxide chemistry, shrinkage matching, grain-boundary behavior, and electrode-dielectric interface continuity, process limits, validation, and qualification boundaries.

Ler conteúdo

Interpretação de dados de capacitância, dissipação, resistência de isolamento, polarização, temperatura e fiabilidade

Interpreting Capacitance, Dissipation, Insulation Resistance, Bias, Temperature, and Reliability Data — a method-conditioned engineering guide for MLCC Internal-Electrode, Termination & Dielectric Materials covering particle packing, surface oxide chemistry, shrinkage matching, grain-boundary behavior, and electrode-dielectric interface continuity, process limits, validation, and qualification boundaries.

Ler conteúdo

Eletrodo MLCC qualificado, terminação e materiais dielétricos com controlos de COA, queima, lote e mudança

Qualifying MLCC Electrode, Termination, and Dielectric Materials with COA, Firing, Lot, and Change Controls — a method-conditioned engineering guide for MLCC Internal-Electrode, Termination & Dielectric Materials covering particle packing, surface oxide chemistry, shrinkage matching, grain-boundary behavior, and electrode-dielectric interface continuity, process limits, validation, and qualification boundaries.

Ler conteúdo